Control:

 

- First sample control

- Etch control

- AOI-test

- HAL-control

- Electrical test (Adapter)

- Electrical test (Finger test)

- Final check

 

Laboratory:

 

- Analysis of the chemicals

- Polished cut image

 

Means:

 

- Air-conditioned rooms for filmplott + exposure

- Air-conditioned room for measuring machine + laboratory equipment

- CCD-filmstamping machine

- CCD-exposure unit

- CCD-inner layer stamping automat

- Program controlled multilayer press with vacuum

- Galvanoautomat with both-sided, separated current feed

- Fully automatic drilling machines

- Fully automatic milling machines with CCD-camera system

 

Drilling tolerances:

 

- Diameter 0 0,2 – 2,0 mm / Tol. + - 0,10 mm

- Diameter > 2,0 - 5,3 mm / Tol. + - 0,15 mm
- Diameter > 5,3 - 6,1 mm / Tol. + - 0,20 mm
- Diameter > 6,1 mm / Tol. + - 0,20 mm (Milling technology)
- Lengths tolerances
- Measure of length 0,5 - 006,0 mm / Tol. + - 0,10 mm
- Measure of length 6,0 - 400,0 mm / Tol. + - 0,20 mm

Thickness tolerances:

 

- Tolerances without copper + - 10 % related to nominal thickness

Basic principles:

 

- Perfag for developers + PCB-producers


Surfaces (Job):

- HAL lead-containing (composition 60/40) 5 - 30 µm
- HAL lead-free (Balver-Tin) 5 - 30 µm
- Chemical Tin 1,1 - 1,2 µm Tin
- Gold (Boding) 4 µm Nickel + 5 - 7 µm Gold
- Connector hard Gold 4 µm Nickel + min. 1,27 µm Gold
- Chemical Gold 4 µm Nickel + 0,05 - 0,1 µm Gold
- Chemical Silver 0,2 - 0,5 µm Silver

Solder resist:

 

- XV-501 T4 (Curtain coating method)
- Dielectric strength 100 KV/mm
- Pouring weight 110 g/qm
- Flank protection min. 8 µm at the edges
- Web thickness 80 µm / Offset 160 µm