Conductor Width / Distances

Finest Conductors 80 µ / 100 µ bei 12 µ Copper Baser / 35 µ Final Strength

Fine Conductors 100 µ / 120 µ bei 18 µ Copper Base / 35 µ Final Strength

Standard 150 µ / 150 µ bei 18 µ Copper Base / 35 µ Final Strength

Standard 150 µ / 160 µ bei 35 µ Copper Base / 55-70 µ Final Strength

Standard 200 µ / 220 µ bei 70 µ Copper Base / 95 µ Final Strength

Special 250 µ / 270 µ bei 70 µ Copper Base / 105 µ Final Strength

Cu-Thickness

Cu-Conductor Structure Copper Base + ca. 25 µ

Standard Process 30 µ - 42 µ Final Copper (min. 30 µ)

Special Process 70 µ Final Copper (min. 55 µ)

Special Process 95 µ Final Copper (min. 80 µ)

Spezial Process 105 µ Final Copper (min. 90 µ)

Metallization

Drillings t = PCB-Thickness; d = Drill Hole diameter

For d > 0,25 x t: min. 20 µ Cu in Drillings (PERFAG)

For 0,2 x t ≤ d ≤ 0,25 x t: min. 18 µ Cu in Drillings (PERFAG)